Business wire
Laser Photonics to Showcase Laser Solutions for Semiconductor Industry at IEEE International Electron Devices Meeting 2024
Karla Kizzort
Marketing Specialist
Laser Photonics Corporation
kkizzort@laserphotonics.com
Laser Photonics Corporation (LPC) (NASDAQ: LASE), a leading global industrial developer of systems for laser cutting, marking and other material applications, announced today that it will attend the International Electron Devices Meeting 2024 to present advanced laser solutions for the semiconductor industry.
IEDM 2024, hosted by the Institute of Electrical and Electronics Engineers (IEEE) and the Electron Devices Society, is the premier global forum for breakthroughs in semiconductor and electronic device technology. It gathers industry leaders, engineers, and scientists from around the world to discuss advancements in semiconductor design and manufacturing, optoelectronics, nanoscale devices, simulation, and more. This year marks the 70th annual IEEE IEDM.
Wayne Tupuola, CEO of LPC, stated, “For Laser Photonics, IEDM is an excellent platform to present our state-of-the-art solutions for dicing and marking of silicon, sapphire and compounds. We are excited to relay how quickly and accurately laser technology can process brittle crystalline materials used in semiconductors, solar panels, and related products.”
Visitors to LPC’s booth at IEDM 2024 can learn about the BlackStar Laser Wafer Dicer engineered for optimal die singulation; the High-Precision Wafer Serialization, Marking and Scribing laser solution for traceability, scribing and lapping; and the Laser Marking of IC Mold Compounds system with high-speed fiducial recognition for marking the smallest parts without any risk of damage.
What: 70th Annual IEEE International Electron Devices Meeting
When: December 7 - 11, 2024
Where: Booth 3, Yosemite Ballroom, Hilton San Francisco
Union Square, 333 O’Farrell Street, San Francisco, CA
About BlackStar Laser Wafer Dicer
Powered by Fantom Width Laser Dicing (FWLD) technology, the BlackStar helps maximize die yield per wafer and minimize material loss. Equipped with a short-pulse laser, this technology addresses silicon dicing challenges like impact damage and thermal distortions. The BlackStar offers versatility in processing various die sizes, while the dry processing technique eliminates water use and extra handling, with no replacement parts or regular maintenance needed. The BlackStar is a Class I enclosed laser system equipped with safe viewing windows that prevent accidental exposure to laser radiation, interlocks to deactivate the laser in open mode, key control, and other safety features.
About High-Precision Wafer Serialization, Marking and Scribing
This next-generation laser system for optimized wafer traceability is custom-tailored specifically for your requirements, including the geometries, dimensions, line width, slag tolerances, safety features and cleanroom protocols. This system processes silicon, sapphire, compounds (GaAS, InP, SiCO2, SiGe, etc.), crystal wafers (LiTaO3 and LiNbO3) or photo resist. It is built to accommodate a range of wafer sizes and thicknesses and features a dual end effector robot for wafer movement. Laser type will depend on wafer material and marking requirements.
About Laser Marking of IC Mold Compounds
These systems use state-of-the-art machine vision that travels through a laser scanhead to achieve high-speed fiducial recognition. This allows to mark characters at sizes precisely in accordance with user requirements, with no damage risk down to even the smallest parts. This enclosed Class I system integrates an ultraviolet laser and is configured to accept JEDEC trays with small-scale computer chips, using the sophisticated vision system for perfect alignment with their positioning. Non-contact laser marking requires no consumables or additives to generate permanent, high-contrast markings, data matrices, logos, shapes, and text on IC mold compounds and ceramics.
About Laser Photonics Corporation
Laser Photonics is a vertically integrated manufacturer and R&D Center of Excellence for industrial laser technologies and systems. Laser Photonics seeks to disrupt the $46 billion, centuries-old sand and abrasives blasting markets, focusing on surface cleaning, rust removal, corrosion control, de-painting and other laser-based industrial applications. Laser Photonics’ new generation of leading-edge laser blasting technologies and equipment also addresses the numerous health, safety, environmental and regulatory issues associated with old methods. As a result, Laser Photonics has quickly gained a reputation as a leader in industrial laser systems with a brand that stands for quality, technology and product innovation. Currently, world-renowned and Fortune 1000 manufacturers in the aerospace, automotive, defense, energy, maritime, medical device, nuclear and pharmaceutical, and space industries are using Laser Photonics’ “unique-to-industry” systems. For more information, visit https://www.laserphotonics.com.
About IEEE
IEEE is the world’s largest technical professional organization dedicated to advancing technology for the benefit of humanity. Through its highly cited publications, conferences, technology standards, and professional and educational activities, IEEE is the trusted voice in a wide variety of areas ranging from aerospace systems, computers, and telecommunications to biomedical engineering, electric power, and consumer electronics. Learn more at https://www.ieee.org.
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